224-5248-19-0602J
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onzuu Part #:
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224-5248-19-0602J
411-224-5248-19-0602J
RECEPTACLE DIP SOCKET 24POS .3"
224-5248-19-0602J Description
IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To DIP, 0.3" (7.62mm) Row Spacing Through Hole
Technical specifications
| Housing Material | Polysulfone (PSU), Glass Filled | |
| Current Rating (Amps) | 1 A | |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) | |
| Material Flammability Rating | UL94 V-0 | |
| Product Status | Active | |
| Convert To (Adapter End) | DIP, 0.3" (7.62mm) Row Spacing | |
| Pitch - Post | 0.100" (2.54mm) | |
| Mfr | 3M | |
| Number of Pins | 24 | |
| Features | - | |
| Pitch - Mating | 0.100" (2.54mm) | |
| RoHS Status | RoHS Compliant | |
| Convert From (Adapter End) | DIP, 0.3" (7.62mm) Row Spacing | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Contact Finish - Mating | Gold | |
| Operating Temperature | -55°C ~ 125°C | |
| Contact Material - Post | Beryllium Copper | |
| ECCN | EAR99 | |
| Termination | Solder | |
| Mounting Type | Through Hole | |
| Contact Finish Thickness - Post | 30.0µin (0.76µm) | |
| Series | Textool™ | |
| Board Material | - | |
| Contact Finish - Post | Gold | |
| Contact Material - Mating | Beryllium Copper | |
| HTSUS | 8536.69.4040 | |
| Package | Box | |
| Base Product Number | 224 |
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