Category | Power MOSFET | |
Configuration | Single | |
PCB changed | 2 | |
Typical Turn-Off Delay Time (ns) | 170(Max) | |
HTS | COMPONENTS | |
Maximum Gate Source Leakage Current (nA) | 100 | |
Number of Elements per Chip | 1 | |
ECCN (US) | EAR99 | |
Typical Rise Time (ns) | 190(Max) | |
PPAP | No | |
Maximum Power Dissipation (mW) | 150000 | |
Channel Mode | Enhancement | |
Typical Turn-On Delay Time (ns) | 35(Max) | |
Automotive | No | |
Minimum Operating Temperature (°C) | -55 | |
Maximum Operating Temperature (°C) | 150 | |
Supplier Package | TO-3 | |
Maximum IDSS (uA) | 25 | |
Typical Fall Time (ns) | 130(Max) | |
Package Height | 7.74(Max) | |
Typical Gate to Source Charge (nC) | 19(Max) | |
Maximum Positive Gate Source Voltage (V) | 20 | |
Channel Type | N | |
EU RoHS | Not Compliant | |
Maximum Continuous Drain Current (A) | 12 | |
Maximum Pulsed Drain Current @ TC=25°C (A) | 48 | |
Maximum Gate Source Voltage (V) | ±20 | |
Maximum Drain Source Voltage (V) | 500 | |
Maximum Drain Source Resistance (mOhm) | 500@10V | |
Package Length | 39.37(Max) | |
Typical Gate Charge @ 10V (nC) | 120(Max) | |
Standard Package Name | TO | |
Maximum Diode Forward Voltage (V) | 1.7 | |
Pin Count | 3 | |
Mounting | Through Hole | |
Operating Junction Temperature (°C) | -55 to 150 | |
Minimum Gate Threshold Voltage (V) | 2 | |
Tab | Tab | |
Lead Shape | Through Hole | |
Part Status | Active | |
Typical Gate to Drain Charge (nC) | 70(Max) | |
Maximum Gate Threshold Voltage (V) | 4 | |
Package Width | 25.53(Max) | |
Typical Gate Charge @ Vgs (nC) | 120(Max)@10V | |