MX25L6406EM2I-12G (In Stock:20048)

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MX25L6406EM2I-12G
774-MX25L6406EM2I-12G
IC FLASH 64MBIT SPI 86MHZ 8SOP

MX25L6406EM2I-12G Description

FLASH - NOR Memory IC 64Mbit SPI 86 MHz 8-SOP

Technical specifications

Clock Frequency86 MHz
Program Current (mA)20
Programming Voltage (V)2.7 to 3.6
PPAPNo
Operating Current (mA)25
Memory TypeNon-Volatile
Product StatusNot For New Designs
AutomotiveNo
Supplier PackageSOP
Chip Density (bit)64M
Timing TypeSynchronous
Package / Case8-SOIC (0.209", 5.30mm Width)
TechnologyFLASH - NOR
Voltage - Supply2.7V ~ 3.6V
REACH StatusREACH Unaffected
Maximum Operating Supply Voltage (V)3.6
EU RoHSCompliant
Sector Size4Kbyte x 2048
Moisture Sensitivity Level (MSL)3 (168 Hours)
Number of Words64M/32M
Operating Temperature-40°C ~ 85°C (TA)
Memory InterfaceSPI
ArchitectureSectored
Block OrganizationSymmetrical
Minimum Endurance (Cycles)100000(Typ)
ECCN3A991B1A
Memory Organization8M x 8
Supplier Temperature GradeIndustrial
Mounting TypeSurface Mount
Standard Package NameSO
Cell TypeNOR
Pin Count8
MountingSurface Mount
Memory Size64Mbit
Max. Access Time (ns)8
Lead ShapeGull-wing
Typical Operating Supply Voltage (V)3.3
HTSUS8542.32.0071
PackageTube
ProgrammabilityYes
PCB changed8
HTS8542.32.00.71
ECCN (US)3A991b.1.a.
Supplier Device Package8-SOP
Command CompatibleYes
Minimum Operating Temperature (°C)-40
Maximum Operating Temperature (°C)85
Process Technology110nm, CMOS
Package Height1.8
MfrMacronix
Maximum Programming Time (ms)3/Page
Memory FormatFLASH
Interface TypeSerial (SPI, Dual SPI)
Maximum Erase Time (s)80/Chip
RoHS StatusROHS3 Compliant
Boot BlockNo
Number of Bits/Word (bit)8/16
ECC SupportNo
Support of Page ModeNo
Page Size256byte
Package Length5.23
Address Width (bit)24
SeriesMX25xxx05/06/08
Write Cycle Time - Word, Page300µs, 5ms
Part StatusActive
Package Width5.28
Base Product NumberMX25L6406
Minimum Operating Supply Voltage (V)2.7

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