A3P1000-FGG144M

The A3P1000-FGG144M is a high-density, low-power ProASIC3 FPGA designed by Actel Corporation, now part of Microsemi Corporation, for military and aerospace applications where robust performance and reliability are paramount. This device has passed thorough military temperature testing and qualification, allowing it to operate at temperatures ranging from -55°C to 125°C. It has a capability of up to 1,000,000 system gates, 504kbits of True Dual-Port SRAM, and up to 620 user I/Os for flexible system integration. The A3P1000-FGG144M uses a 130-nm, 7-layer metal (6 copper) flash-based CMOS process that enables reprogrammable flash technology and preserves the programmed design when turned off. It also supports 1.2V to 1.5V core and I/O voltages, resulting in reduced power consumption, particularly in Flash*Freeze mode, which allows for fast entrance and exit from low-power states. The device's high-performance routing hierarchy and clock structure provide system performance of up to 350MHz for 1.5V systems and 250MHz for 1.2V systems. Advanced security features such as Secure ISP with on-chip 128-bit AES and FlashLock® protect the FPGA's contents. The A3P1000-FGG144M is a dependable and secure FPGA solution designed for the most demanding applications in hostile environments.