A3P250-2FGG256

FPGAs
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A3P250-2FGG256
696-A3P250-2FGG256
IC FPGA 157 I/O 256FBGA

A3P250-2FGG256 Description

The A3P250-2FGG256 is a high-performance, low-power, and highly integrated memory device from Microchip Technology. This device is a 256-Mbit (32-Mbyte) DDR NAND Flash memory with a 2 Gb page size and a 256-byte byte size. Key features of the A3P250-2FGG256 include: 1. High performance: The A3P250-2FGG256 offers high read and write speeds, making it suitable for a wide range of applications that require fast data access. 2. Low power consumption: The device is designed to consume minimal power, making it ideal for battery-powered devices and other applications where power consumption is a concern. 3. High integration: The A3P250-2FGG256 is highly integrated, meaning it combines multiple functions into a single chip. This reduces the overall size and complexity of the system, making it easier to design and manufacture. 4. Robustness: The device is designed to be highly reliable and resistant to various environmental factors, such as temperature and humidity. Applications for the A3P250-2FGG256 include: 1. Consumer electronics: The A3P250-2FGG256 can be used in a wide range of consumer electronics, such as smartphones, tablets, and digital cameras. 2. Industrial applications: The device can be used in industrial applications where high performance and reliability are critical, such as in control systems and automation equipment. 3. Automotive applications: The A3P250-2FGG256 can be used in automotive applications, such as infotainment systems and navigation systems, where fast data access and low power consumption are important. 4. Medical devices: The device can be used in medical devices, such as imaging systems and patient monitoring equipment, where high performance and reliability are essential. Overall, the A3P250-2FGG256 is a versatile and high-performance memory device that can be used in a wide range of applications where fast data access, low power consumption, and high reliability are important.

Technical specifications

Operating Temperature0°C ~ 85°C (TJ)
Total RAM Bits36864
ECCN3A991D
Number of I/O157
Mounting TypeSurface Mount
Product StatusActive
Supplier Device Package256-FPBGA (17x17)
SeriesProASIC3
Package / Case256-LBGA
Voltage - Supply1.425V ~ 1.575V
REACH StatusREACH Unaffected
MfrMicrochip Technology
Number of Gates250000
HTSUS8542.39.0001
PackageTray
RoHS StatusROHS3 Compliant
Base Product NumberA3P250
Moisture Sensitivity Level (MSL)3 (168 Hours)

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