Unit Weight | 0.168198 oz | |
Voltage Rating | 300 V | |
Housing Material | Polybutylene Terephthalate (PBT), Glass Filled | |
Current Rating (Amps) | 1 A | |
Contact Finish Thickness - Mating | 10.0µin (0.25µm) | |
Product | DIP / SIP Sockets | |
Material Flammability Rating | UL94 V-0 | |
Product Status | Active | |
RoHS | RoHS Compliant By Exemption | |
Pitch - Post | 0.100" (2.54mm) | |
REACH Status | REACH Affected | |
Mfr | Omron Electronics Inc-EMC Div | |
Contact Material | Beryllium Copper Alloy | |
Features | Open Frame | |
Pitch - Mating | 0.100" (2.54mm) | |
Maximum Operating Temperature | + 125 C | |
Contact Resistance | 20mOhm | |
RoHS Status | ROHS3 Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Mounting Style | Through Hole | |
Contact Finish - Mating | Gold | |
Operating Temperature | -55°C ~ 125°C | |
Number of Rows | 2 Row | |
Contact Material - Post | Beryllium Copper | |
Number of Positions | 8 Position | |
Termination Style | Solder Pin | |
Current Rating | 1 A | |
ECCN | EAR99 | |
Row Spacing | 7.62 mm | |
Termination | Solder | |
Mounting Type | Through Hole | |
Minimum Operating Temperature | - 55 C | |
Number of Positions or Pins (Grid) | 8 (2 x 4) | |
Contact Finish Thickness - Post | 10.0µin (0.25µm) | |
Series | XR2 | |
Type | DIP, 0.3" (7.62mm) Row Spacing | |
Contact Plating | Gold | |
Contact Finish - Post | Gold | |
Pitch | 2.54 mm | |
Termination Post Length | 0.126" (3.20mm) | |
Contact Material - Mating | Beryllium Copper | |
HTSUS | 8536.69.4040 | |
Package | Bulk | |
USHTS | 8536694040 | |
Base Product Number | XR2A | |