Typical Input Capacitance @ Vds (pF) | 630@10V | |
Category | Power MOSFET | |
Configuration | Single | |
PCB changed | 2 | |
Maximum Gate Source Leakage Current (nA) | 10000 | |
Number of Elements per Chip | 1 | |
ECCN (US) | EAR99 | |
Typical Rise Time (ns) | 25 | |
PPAP | No | |
Maximum Power Dissipation (mW) | 20000 | |
Channel Mode | Enhancement | |
Automotive | No | |
Minimum Operating Temperature (°C) | -55 | |
Maximum Operating Temperature (°C) | 150 | |
Supplier Package | New PW-Mold | |
Maximum IDSS (uA) | 100 | |
Typical Fall Time (ns) | 55 | |
Process Technology | L2-pi-MOS V | |
Package Height | 2.3 | |
Channel Type | P | |
EU RoHS | Supplier Unconfirmed | |
Maximum Continuous Drain Current (A) | 5 | |
Maximum Gate Source Voltage (V) | ±20 | |
Maximum Drain Source Voltage (V) | 60 | |
Maximum Drain Source Resistance (mOhm) | 190@10V | |
Material | Si | |
Package Length | 6.5 | |
Typical Gate Charge @ 10V (nC) | 22 | |
Standard Package Name | TO-251 | |
Pin Count | 3 | |
Mounting | Surface Mount | |
Tab | Tab | |
Lead Shape | Gull-wing | |
Part Status | LTB | |
Maximum Gate Threshold Voltage (V) | 2 | |
Package Width | 5.5 | |
Typical Gate Charge @ Vgs (nC) | 22@10V | |