| Number of Channels per Chip | 1 | |
| Minimum Isolation Voltage (Vrms) | 5000 | |
| PPAP | No | |
| Fall Time | 40 ns | |
| RoHS | RoHS Compliant | |
| Automotive | No | |
| Maximum Data Rate | 2Mbps | |
| Supplier Package | DIP SMD | |
| Vr - Reverse Voltage | 6 V | |
| Package / Case | SMD-6 | |
| Number of Channels | 1 Channel | |
| Typical Forward Voltage (V) | 1 | |
| EU RoHS | Compliant | |
| Isolation Voltage | 5000 Vrms | |
| Maximum Rise Time (us) | 0.5 | |
| Output Current | 50 mA | |
| ECCN | EAR99 | |
| Typical Fall Time (us) | 0.04 | |
| Standard Package Name | DIP | |
| Pin Count | 6 | |
| Mounting | Surface Mount | |
| Rise Time | 50 ns | |
| Package | Tape and Reel | |
| USHTS | 8541498000 | |
| PCB changed | 6 | |
| HTS | 8541.49.80.00 | |
| Output Type | Phototransistor | |
| ECCN (US) | EAR99 | |
| Standard | cUL|DIN|UL|VDE | |
| Maximum Power Dissipation (mW) | 130 | |
| Direction Type | Uni-Directional | |
| Typical Rise Time (us) | 0.05 | |
| Minimum Operating Temperature (°C) | -40 | |
| Maximum Operating Temperature (°C) | 100 | |
| Vf - Forward Voltage | 1.1 V | |
| Data Rate | 1 Mb/s | |
| Package Height | 3.5 | |
| Maximum Reverse Voltage (V) | 6 | |
| Maximum Operating Temperature | + 100 C | |
| If - Forward Current | 4 mA | |
| Maximum Forward Current (mA) | 50 | |
| Maximum Forward Voltage (V) | 1.4 | |
| Mounting Style | SMD/SMT | |
| Input Type | DC | |
| Minimum Forward Voltage (V) | 0.7 | |
| Logic Gate Type | AND | |
| Package Length | 7.3 | |
| Minimum Operating Temperature | - 40 C | |
| Maximum Fall Time (us) | 0.5 | |
| Part Status | Active | |
| Package Width | 6.5 | |
| Pd - Power Dissipation | 250 mW | |
