W25Q256JVEIQ (In Stock:3928)

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W25Q256JVEIQ Description

Winbond Electronics Corporation's W25Q256JVEIQ is a high-performance, high-density, and low-power Serial Flash memory designed for use in a wide range of applications. Here is a detailed description of the model, its features, and potential applications: **Model:** W25Q256JVEIQ ### Description: The W25Q256JVEIQ is a 256Mbit (32MB) Serial Flash memory chip that utilizes a standard Serial Peripheral Interface (SPI) bus for communication. It is designed to provide a reliable, high-density, and low-power memory solution for various embedded systems and applications. ### Features: 1. **High Density:** With a storage capacity of 256Mbit, the W25Q256JVEIQ offers a high-density memory solution for applications requiring large amounts of non-volatile storage. 2. **Low Power Consumption:** The device is designed to operate with low power consumption, making it suitable for battery-powered devices and systems where power efficiency is critical. 3. **Standard SPI Interface:** The W25Q256JVEIQ uses a standard SPI bus for communication, ensuring compatibility with a wide range of microcontrollers and embedded systems. 4. **Fast Read Speeds:** The device supports fast read speeds, allowing for quick access to stored data. 5. **Dual/Quad/Octal I/O Options:** The W25Q256JVEIQ offers flexible I/O options, including dual, quad, and octal SPI configurations, to meet the requirements of different system designs. 6. **Data Retention:** The device provides excellent data retention characteristics, ensuring that stored data remains intact even in the absence of power. 7. **Endurance:** The W25Q256JVEIQ is designed for a high number of program/erase (P/E) cycles, making it suitable for applications with frequent data updates. 8. **Security Features:** The device includes various security features, such as write protection and secure erase, to protect stored data from unauthorized access. 9. **Operating Temperature Range:** The W25Q256JVEIQ is available in different temperature grades, including industrial (-40°C to +85°C) and automotive (-40°C to +105°C), making it suitable for a wide range of operating environments. ### Applications: 1. **Industrial Automation:** The W25Q256JVEIQ can be used in industrial control systems for storing firmware, configuration settings, and operational data. 2. **Medical Devices:** The device can be used in medical equipment for storing patient data, device settings, and firmware. 3. **Automotive Systems:** The W25Q256JVEIQ is suitable for automotive applications, such as infotainment systems, telematics, and engine control units, due to its automotive-grade temperature range and reliability. 4. **Consumer Electronics:** The device can be used in consumer electronics, such as set-top boxes, smart home devices, and IoT devices, for storing firmware, user settings, and application data. 5. **Wearable Devices:** The low power consumption and high-density storage make the W25Q256JVEIQ an ideal choice for wearable devices, such as fitness trackers and smartwatches. 6. **Data Logging:** The W25Q256JVEIQ can be used in data logging applications, such as environmental monitoring and industrial equipment monitoring, to store large amounts of data over time. 7. **Embedded Systems:** The device is suitable for various embedded systems that require non-volatile memory for storing code, configuration, and operational data. In summary, the Winbond Electronics Corporation's W25Q256JVEIQ is a versatile, high-density, and low-power Serial Flash memory that offers a range of features suitable for a wide variety of applications, from industrial automation and medical devices to automotive systems and consumer electronics.

Technical specifications

Unit Weight0.092115 oz
Clock Frequency133 MHz
Program Current (mA)25
Programming Voltage (V)2.7 to 3.6
PPAPNo
Operating Current (mA)25
Memory TypeNon-Volatile
Product StatusActive
RoHSRoHS Compliant
AutomotiveNo
Active Read Current - Max25 mA
TradenameSpiFlash
Supplier PackageWSON EP
Chip Density (bit)256M
Timing TypeSynchronous
Package / Case8-WDFN Exposed Pad
TechnologyFLASH - NOR
Voltage - Supply2.7V ~ 3.6V
REACH StatusREACH Unaffected
Maximum Clock Frequency133 MHz
Maximum Operating Supply Voltage (V)3.6
EU RoHSCompliant
Sector Size4Kbyte x 8192
Moisture Sensitivity Level (MSL)3 (168 Hours)
Number of Words32M
Operating Temperature-40°C ~ 85°C (TA)
Memory InterfaceSPI - Quad I/O
ArchitectureSectored
Block OrganizationSymmetrical
Minimum Endurance (Cycles)100000
ECCN3A991B1A
Memory Organization32M x 8
Supplier Temperature GradeIndustrial
Mounting TypeSurface Mount
Standard Package NameSON
Cell TypeNOR
Pin Count8
MountingSurface Mount
Memory Size256Mbit
Moisture SensitiveYes
Max. Access Time (ns)6
Typical Operating Supply Voltage (V)3|3.3
HTSUS8542.32.0071
PackageTube
USHTS8542320051
ProgrammabilityYes
Organization32 M x 8
PCB changed8
HTS8542.39.00.60
ECCN (US)3A991b.1.a.
Supply Voltage - Min2.7 V
Supplier Device Package8-WSON (8x6)
Command CompatibleYes
Address Bus Width (bit)32
Minimum Operating Temperature (°C)-40
Maximum Operating Temperature (°C)85
Package Height0.73
MfrWinbond Electronics
Maximum Operating Temperature+ 85 C
Maximum Programming Time (ms)3/Page
Supply Voltage - Max3.6 V
Memory FormatFLASH
Interface TypeSerial (SPI, Dual SPI, Quad SPI)
Maximum Erase Time (s)400/Chip
RoHS StatusROHS3 Compliant
Boot BlockNo
Mounting StyleSMD/SMT
Number of Bits/Word (bit)8
ECC SupportNo
Data Bus Width8 bit
Support of Page ModeNo
Page Size256byte
Package Length6
Minimum Operating Temperature- 40 C
SeriesSpiFlash®
Write Cycle Time - Word, Page3ms
Maximum Operating Frequency (MHz)133
Part StatusActive
Package Width8
Base Product NumberW25Q256
Minimum Operating Supply Voltage (V)2.7

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