let’s break down practical 5 V over-voltage protection (OVP) options and how to size them, centered on three popular approaches: using (1) a voltage-regulator-style series pass element, (2) a BJT (“transistor”) circuit, and (3) a MOSFET. I’ll give you quick reference schematics (described in words), trip-point math, pros/cons, and a ready-to-build example for each.
0) First, define your target
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Nominal rail: 5.0 V
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Allowable steady max at the load: e.g., ≤ 5.5 V
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Trip (cut-off) threshold: pick a margin: common is 5.7–6.0 V
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Load current: design for your worst case (examples below use 2 A)
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Protection style:
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Clamp (shunt energy away, load still sees stress but limited)
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Crowbar (short the rail to blow a fuse/reset a polyfuse)
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Series cutoff (disconnect the load—best for sensitive electronics)
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For 5 V logic, series cutoff is usually the safest and least stressful.
1) “Voltage-regulator style” Series Pass (LDO/eFuse approach)
What it is
A series element (LDO pass transistor or dedicated eFuse) sits in-line with the 5 V rail. A comparator/threshold circuit turns it off when input exceeds the limit.
Implementation A: Use a true eFuse / power switch IC
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Behavior: fast OV detect (e.g., 5.6 V), disconnects the load, often adds current limit, soft-start, and reverse protection.
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Pros: minimal design risk, tiny BOM, repeatable thresholds, built-in SOA handling.
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Cons: IC cost; still dissipates some heat under normal load.
(If you want part suggestions just say your current & features—auto-retry vs latch, reverse-block, etc.—and I’ll shortlist a few.)
Implementation B: DIY with TL431 + P-channel MOSFET (cheap & precise)
Schematic (words):
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High-side P-MOSFET: Source→Input 5 V, Drain→Load, Body diode from Load→Input (so pick a “reverse-blocking” variant or arrange back-to-back if you need reverse-polarity protection).
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Gate pulled up to Source with R_GUP (keeps FET normally ON).
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TL431 (2.495 V ref) monitors VIN through a divider (R_TOP to VIN, R_BOT to GND).
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TL431 Cathode → MOSFET Gate (through a resistor); Anode → GND.
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When VIN > VTRIP, TL431 conducts, pulling the gate toward ground? That turns P-FET on, which is the opposite of what we want. So invert:
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Add a small NPN between Gate and Source. TL431 drives the NPN, which pulls gate up to source (V_GS≈0) → FET OFF during over-voltage.
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Trip math:
For TL431: Vtrip=Vref(1+RTOP/RBOT) with Vref≈2.495.
Example V_trip = 5.8 V → RTOP/RBOT=5.8/2.495−1≈1.325.
Pick R_BOT=10 kΩ → R_TOP≈13.3 kΩ (use 13 kΩ + tweak).
Add hysteresis (a 1 MΩ from TL431 cathode to the divider node) to avoid chatter ~20–60 mV.
Sizing tips:
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Choose P-FET with low R_DS(ON) (e.g., ≤ 15 mΩ @ V_GS=−4.5 V) to keep losses low:
P≈I2⋅R. For 2 A and 15 mΩ → 60 mW. -
Gate network: R_GUP ~100 kΩ; TL431 cathode-to-gate resistor 1–4.7 kΩ; NPN base resistor 10–33 kΩ.
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Add a TVS on input if the source can spike (USB-C adapters, cable transients).
Pros: Accurate, low part cost, clean cutoff, scalable.
Cons: Slight complexity; need careful gate-drive polarity.
2) BJT-based OVP (classic crowbar or series cutoff)
A) Crowbar (Zener + SCR/Thyristor or Zener + BJT “slam”)
Schematic (words):
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A zener diode senses VIN. Above its knee, it triggers an SCR (or a saturated NPN pair) that shorts the rail. Upstream fuse/polyfuse opens.
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Set the zener around 5.6–6.2 V (consider tolerance & temp).
Pros: Extremely fast; protects even if the series element fails short.
Cons: Your system hard-resets; must have a fuse; not for battery-only feeds (you’ll just dump current).
B) BJT series cutoff (inexpensive)
Schematic (words):
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High-side PNP as the pass element (or NPN low-side if you can tolerate ground lift).
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A zener + resistor network feeds the base; when VIN rises above zener+V_BE, the PNP turns off.
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Add an emitter resistor for current sensing if you want dual OCP/OVP.
Pros: Cheap, easy; no body-diode direction issues like a P-MOS.
Cons: Higher dropout than MOSFET (V_CE(sat) > R_DS(ON)·I), more heat; worse efficiency.
Quick calc (series cutoff):
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Choose zener VZ and base divider so turn-off occurs at desired Vtrip.
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Ensure base current during OV is enough to fully cut the pass device (consider β and load).
3) MOSFET-only OVP (fast & efficient)
A) Simple zener-gated P-MOSFET cutoff
Schematic (words):
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P-MOSFET high-side; gate pulled down (ON) via resistor to ground through a small NPN; gate pulled up to source (OFF) with another resistor.
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A zener from VIN to NPN base turns the NPN off once VIN exceeds VZ+VBE, letting the gate float up to source → MOSFET OFF.
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With proper polarity, you can avoid the NPN and use a precision zener (or TLVH431) to hold |V_GS| within safe limits and force OFF above the threshold.
Pros: Lowest loss in normal operation; very fast cutoff; simple BOM.
Cons: Zener tolerances and tempco shift the threshold; add trim or use TL431 for precision.
B) Back-to-back N-MOS “ideal diode” with comparator
Schematic (words):
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Two N-MOSFETs source-to-source form a bidirectional off switch (blocks both polarities).
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A comparator/reference (or TL431 + small BJT) pulls the gate driver low when VIN > VTRIP to turn both MOSFETs off.
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Add a gate clamp (transorb or zener) to protect V_GS.
Pros: Adds reverse-polarity and back-feed blocking; robust for USB-C/adapter mishaps.
Cons: Needs a little gate-drive circuitry; more parts than P-MOS alone.
4) Add a clamp anyway (TVS)
Regardless of cutoff method, place a low-cap 5 V TVS (e.g., SMB footprint) at the input. It catches fast spikes the control loop can’t. Pick one whose clamping is below what your load can tolerate (often ~9–12 V for 5 V rails—verify with your device absolute max and surge profile).
5) Worked examples (plug-and-play)
Example 1 — Precise Series Cutoff (TL431 + P-MOS, 2 A rail)
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Target: Trip at 5.8 V, nominal 5 V/2 A.
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MOSFET: P-channel, 30 V, R_DS(ON) ≤ 15 mΩ @ −4.5 V (TO-252 or PowerPAK).
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Divider: RBOT=10kΩ, RTOP=13.3kΩ → Vtrip≈5.8V.
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Hysteresis: 1 MΩ from TL431 cathode to divider node → ~30–60 mV.
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Gate network: R_GUP (gate→source) 100 kΩ; TL431 cathode→gate 2.2 kΩ; TL431 cathode→NPN base 10 kΩ; NPN (S8050/2N3904) from gate→source; base-emitter 100 kΩ.
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TVS: 5 V nominal, SMA/SMB (low capacitance if on USB data).
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Loss @ 2 A: ~60 mW; thermal margin excellent.
Example 2 — Zener-BJT Crowbar (fast, sacrificial)
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Fuse/polyfuse upstream sized to blow/trip at, say, >2.5 A.
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Zener: 5.6 V (±5%); trigger resistor sized to deliver ~20–50 mA into the SCR gate at 6.0 V.
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SCR: Choose I_TSM to withstand inrush until the fuse opens.
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Result: Any surge above ~5.8–6.0 V forces a short → fuse opens; load saved.
Example 3 — Simple P-MOS Zener Cutoff (budget)
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P-MOS: R_DS(ON) ≤ 20 mΩ.
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Zener: 6.2 V to sense; gate clamp 12 V to protect V_GS.
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Resistors: gate pull-up to source 100 kΩ; gate pull-down via NPN as in §3A.
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Trip: ~6.0–6.4 V (zener tolerance/temperature dependent). Cheap & quick.
6) Layout & reliability checklist
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Put the TVS and the series device right at the input connector; keep the high-dI/dt loop tiny.
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Star-route the divider/TL431 ground to the load ground; keep it away from switching currents.
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Add RC snubbers across the MOSFET (or the input) if you see ringing.
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Verify SOA for hot-plug: at trip, the MOSFET might be in linear region briefly.
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If using crowbar, confirm fuse clearing time and SCR I²t.
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For USB-C or hot-swap sources, consider inrush control (gate RC or eFuse soft-start).
7) Which should you pick?
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Most designs: Series cutoff with P-MOS + TL431 (Example 1). Smooth, low-loss, precise.
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Harsh/unknown adapters, absolute safety: Add a crowbar as a secondary failsafe.
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Ultra-simple & cheap: P-MOS + zener (Example 3), accepting wider tolerance.
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Feature-rich & tiny BOM: A dedicated eFuse IC (fastest path to robust results).