Analysis of 5V overvoltage protection circuit: voltage regulator, transistor, MOS transistor

2025-09-12 15:13:31

let’s break down practical 5 V over-voltage protection (OVP) options and how to size them, centered on three popular approaches: using (1) a voltage-regulator-style series pass element, (2) a BJT (“transistor”) circuit, and (3) a MOSFET. I’ll give you quick reference schematics (described in words), trip-point math, pros/cons, and a ready-to-build example for each.

Analysis of 5V overvoltage protection circuit: voltage regulator, transistor, MOS transistor


0) First, define your target

  • Nominal rail: 5.0 V

  • Allowable steady max at the load: e.g., ≤ 5.5 V

  • Trip (cut-off) threshold: pick a margin: common is 5.7–6.0 V

  • Load current: design for your worst case (examples below use 2 A)

  • Protection style:

    • Clamp (shunt energy away, load still sees stress but limited)

    • Crowbar (short the rail to blow a fuse/reset a polyfuse)

    • Series cutoff (disconnect the load—best for sensitive electronics)

For 5 V logic, series cutoff is usually the safest and least stressful.


1) “Voltage-regulator style” Series Pass (LDO/eFuse approach)

What it is

A series element (LDO pass transistor or dedicated eFuse) sits in-line with the 5 V rail. A comparator/threshold circuit turns it off when input exceeds the limit.

Implementation A: Use a true eFuse / power switch IC

  • Behavior: fast OV detect (e.g., 5.6 V), disconnects the load, often adds current limit, soft-start, and reverse protection.

  • Pros: minimal design risk, tiny BOM, repeatable thresholds, built-in SOA handling.

  • Cons: IC cost; still dissipates some heat under normal load.

(If you want part suggestions just say your current & features—auto-retry vs latch, reverse-block, etc.—and I’ll shortlist a few.)

Implementation B: DIY with TL431 + P-channel MOSFET (cheap & precise)

Schematic (words):

  • High-side P-MOSFET: Source→Input 5 V, Drain→Load, Body diode from Load→Input (so pick a “reverse-blocking” variant or arrange back-to-back if you need reverse-polarity protection).

  • Gate pulled up to Source with R_GUP (keeps FET normally ON).

  • TL431 (2.495 V ref) monitors VIN through a divider (R_TOP to VIN, R_BOT to GND).

  • TL431 Cathode → MOSFET Gate (through a resistor); Anode → GND.

  • When VIN > VTRIP, TL431 conducts, pulling the gate toward ground? That turns P-FET on, which is the opposite of what we want. So invert:

    • Add a small NPN between Gate and Source. TL431 drives the NPN, which pulls gate up to source (V_GS≈0) → FET OFF during over-voltage.

Trip math:
For TL431: Vtrip=Vref(1+RTOP/RBOT) with Vref≈2.495.
Example V_trip = 5.8 VRTOP/RBOT=5.8/2.495−1≈1.325.
Pick R_BOT=10 kΩ → R_TOP≈13.3 kΩ (use 13 kΩ + tweak).
Add hysteresis (a 1 MΩ from TL431 cathode to the divider node) to avoid chatter ~20–60 mV.

Sizing tips:

  • Choose P-FET with low R_DS(ON) (e.g., ≤ 15 mΩ @ V_GS=−4.5 V) to keep losses low:
    P≈I2⋅R. For 2 A and 15 mΩ → 60 mW.

  • Gate network: R_GUP ~100 kΩ; TL431 cathode-to-gate resistor 1–4.7 kΩ; NPN base resistor 10–33 kΩ.

  • Add a TVS on input if the source can spike (USB-C adapters, cable transients).

Pros: Accurate, low part cost, clean cutoff, scalable.
Cons: Slight complexity; need careful gate-drive polarity.


2) BJT-based OVP (classic crowbar or series cutoff)

A) Crowbar (Zener + SCR/Thyristor or Zener + BJT “slam”)

Schematic (words):

  • A zener diode senses VIN. Above its knee, it triggers an SCR (or a saturated NPN pair) that shorts the rail. Upstream fuse/polyfuse opens.

  • Set the zener around 5.6–6.2 V (consider tolerance & temp).

Pros: Extremely fast; protects even if the series element fails short.
Cons: Your system hard-resets; must have a fuse; not for battery-only feeds (you’ll just dump current).

B) BJT series cutoff (inexpensive)

Schematic (words):

  • High-side PNP as the pass element (or NPN low-side if you can tolerate ground lift).

  • A zener + resistor network feeds the base; when VIN rises above zener+V_BE, the PNP turns off.

  • Add an emitter resistor for current sensing if you want dual OCP/OVP.

Pros: Cheap, easy; no body-diode direction issues like a P-MOS.
Cons: Higher dropout than MOSFET (V_CE(sat) > R_DS(ON)·I), more heat; worse efficiency.

Quick calc (series cutoff):

  • Choose zener VZ and base divider so turn-off occurs at desired Vtrip.

  • Ensure base current during OV is enough to fully cut the pass device (consider β and load).


3) MOSFET-only OVP (fast & efficient)

A) Simple zener-gated P-MOSFET cutoff

Schematic (words):

  • P-MOSFET high-side; gate pulled down (ON) via resistor to ground through a small NPN; gate pulled up to source (OFF) with another resistor.

  • A zener from VIN to NPN base turns the NPN off once VIN exceeds VZ+VBE, letting the gate float up to source → MOSFET OFF.

  • With proper polarity, you can avoid the NPN and use a precision zener (or TLVH431) to hold |V_GS| within safe limits and force OFF above the threshold.

Pros: Lowest loss in normal operation; very fast cutoff; simple BOM.
Cons: Zener tolerances and tempco shift the threshold; add trim or use TL431 for precision.

B) Back-to-back N-MOS “ideal diode” with comparator

Schematic (words):

  • Two N-MOSFETs source-to-source form a bidirectional off switch (blocks both polarities).

  • A comparator/reference (or TL431 + small BJT) pulls the gate driver low when VIN > VTRIP to turn both MOSFETs off.

  • Add a gate clamp (transorb or zener) to protect V_GS.

Pros: Adds reverse-polarity and back-feed blocking; robust for USB-C/adapter mishaps.
Cons: Needs a little gate-drive circuitry; more parts than P-MOS alone.


4) Add a clamp anyway (TVS)

Regardless of cutoff method, place a low-cap 5 V TVS (e.g., SMB footprint) at the input. It catches fast spikes the control loop can’t. Pick one whose clamping is below what your load can tolerate (often ~9–12 V for 5 V rails—verify with your device absolute max and surge profile).


5) Worked examples (plug-and-play)

Example 1 — Precise Series Cutoff (TL431 + P-MOS, 2 A rail)

  • Target: Trip at 5.8 V, nominal 5 V/2 A.

  • MOSFET: P-channel, 30 V, R_DS(ON) ≤ 15 mΩ @ −4.5 V (TO-252 or PowerPAK).

  • Divider: RBOT=10kΩ, RTOP=13.3kΩ → Vtrip≈5.8V.

  • Hysteresis: 1 MΩ from TL431 cathode to divider node → ~30–60 mV.

  • Gate network: R_GUP (gate→source) 100 kΩ; TL431 cathode→gate 2.2 kΩ; TL431 cathode→NPN base 10 kΩ; NPN (S8050/2N3904) from gate→source; base-emitter 100 kΩ.

  • TVS: 5 V nominal, SMA/SMB (low capacitance if on USB data).

  • Loss @ 2 A: ~60 mW; thermal margin excellent.

Example 2 — Zener-BJT Crowbar (fast, sacrificial)

  • Fuse/polyfuse upstream sized to blow/trip at, say, >2.5 A.

  • Zener: 5.6 V (±5%); trigger resistor sized to deliver ~20–50 mA into the SCR gate at 6.0 V.

  • SCR: Choose I_TSM to withstand inrush until the fuse opens.

  • Result: Any surge above ~5.8–6.0 V forces a short → fuse opens; load saved.

Example 3 — Simple P-MOS Zener Cutoff (budget)

  • P-MOS: R_DS(ON) ≤ 20 mΩ.

  • Zener: 6.2 V to sense; gate clamp 12 V to protect V_GS.

  • Resistors: gate pull-up to source 100 kΩ; gate pull-down via NPN as in §3A.

  • Trip: ~6.0–6.4 V (zener tolerance/temperature dependent). Cheap & quick.


6) Layout & reliability checklist

  • Put the TVS and the series device right at the input connector; keep the high-dI/dt loop tiny.

  • Star-route the divider/TL431 ground to the load ground; keep it away from switching currents.

  • Add RC snubbers across the MOSFET (or the input) if you see ringing.

  • Verify SOA for hot-plug: at trip, the MOSFET might be in linear region briefly.

  • If using crowbar, confirm fuse clearing time and SCR I²t.

  • For USB-C or hot-swap sources, consider inrush control (gate RC or eFuse soft-start).


7) Which should you pick?

  • Most designs: Series cutoff with P-MOS + TL431 (Example 1). Smooth, low-loss, precise.

  • Harsh/unknown adapters, absolute safety: Add a crowbar as a secondary failsafe.

  • Ultra-simple & cheap: P-MOS + zener (Example 3), accepting wider tolerance.

  • Feature-rich & tiny BOM: A dedicated eFuse IC (fastest path to robust results).

Harendra Kumar
Harendra Kumar
Harendra Kumar holds a Ph.D. in Electrical Engineering with a specialization in power electronics. His academic expertise and years of experience allow him to break down complex concepts into clear, actionable information for his audience. Through his work, he aims to bridge the gap between advanced technology and its real-world applications. Harendra is an accomplished writer who specializes in creating high-quality, long-form technical articles on power electronics for B2B electronics platforms. His content combines deep technical knowledge with practical insights, making it a valuable resource for professionals in the electronics industry.